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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HR200201 Issued Date : 1996.03.14 Revised Date : 2002.08.13 Page No. : 1/2 HSC2625 NPN EPITAXIAL PLANAR TRANSISTOR Description The HSC2625 is designed for triple diffused planer type high voltage, high speed switching applications. Absolute Maximum Ratings (Ta=25C) TO-3P * Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 C Junction Temperature.................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) .................................................................................... 80 W * Maximum Voltages and Currents VCBO Collector to Base Voltage ....................................................................................... 450 V VCEO Collector to Emitter Voltage.................................................................................... 400 V VEBO Emitter to Base Voltage.............................................................................................. 7 V IC Collector Current ............................................................................................................ 10 A IB Base Current ..................................................................................................................... 3 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 Min. 450 400 7 10 6 Typ. Max. 1 100 1.2 1.5 30 Unit V V mA uA V V Test Conditions IC=1mA IC=10mA IE=100uA VCB=450V VEB=7V IC=4A, IB=800mA IC=4A, IB=800mA IC=0.5A, VCE=5V IC=4A, VCE=5V *Pulse Test: Pulse Width 380us, Duty Cycle2% HSC2625 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-3P Dimension A B C D a2 GH I H a1 1 2 3 J L N O a1 a1 P a1 r3 a1 U M T a3 Spec. No. : HR200201 Issued Date : 1996.03.14 Revised Date : 2002.08.13 Page No. : 2/2 Marking: R S r1 r2 E F H 2625 Date Code SC Control Code Style: Pin 1.Base 2.Collector 3.Emitter K 3-Lead TO-3P Plastic Package, HSMC Package Code: R Inches Min. 0.0315 0.2028 0.2028 0.7283 0.1811 0.0571 0.0472 3.10 Max. 0.0472 0.2264 0.2264 0.7441 0.1969 0.0650 0.0630 *3o *2o *1o 3.30 *1.60 *R0.50 *: Typical Millimeters Min. Max. 0.80 1.20 5.15 5.75 5.15 5.75 18.50 18.90 4.60 5.00 1.45 1.65 1.20 1.60 *3o *2o *1o 3.10 3.30 *1.60 *R0.50 DIM A B C D E F G H I J K L M Inches Min. 0.6063 0.5276 0.3701 0.1417 0.5394 0.4945 0.7756 0.9134 0.1299 0.0709 0.1102 0.6378 Max. 0.6220 0.5433 0.3858 *0.3150 0.1575 0.5551 0.5102 0.7913 0.9291 0.1457 0.0866 0.1260 0.6614 Millimeters Min. Max. 15.40 15.80 13.40 13.80 9.40 9.80 *8.00 3.60 4.00 13.70 14.10 12.56 12.96 19.70 20.10 23.20 23.60 3.30 3.70 1.80 2.20 2.80 3.20 16.20 16.80 DIM N O P Q R S T a1 a2 a3 r1 r2 r3 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSC2625 HSMC Product Specification Head Office And Factory: |
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